374624B00032G
Boyd Corporation Also known as: Thermshield
Description: HEAT SINK; Thermal Resistance:23.4-ÝC/W; Packages Cooled:BGA; External Width - Metric:35mm; External Height - Metric:10.16mm
Avg. Price $2.19 | Auth QOH 769 | Ind QOH 0
Part Status: ACTIVE
Lead Time: 6 weeks
Distributor | Disti# | RoHS Status | Pkg. | Stock (as of) | Price | |||
---|---|---|---|---|---|---|---|---|
Future Electronics | C023644086 | STDMFR | Inquire | 1 $2.19 | BUY | |||
Master Electronics | Compliant | 769 | 10 $4.831 50 $4.831 250 $4.371 510 $4.349 1K $4.327 3K $4.305 5K $4.284 8K $4.263 | BUY | ||||